pcb-rnd user manual

# pcb-rnd User Manual: Appendix

## 9.6 Glossary

### Useful terminology for a common vernacular

This glossary is under construction. It currently combines terms that focus pertain to any of the following facet subjects.

1. pcb-rnd specific terminology
2. pcb manufacturer terminology
3. pcb CAD layout and design terminology
4. CAD/graphics common design terminology

We will fill in definitions, continue to add terms, and determine an appropriatly faceted method to index the terms.

Combined Glossary Table term | description | facets 5/5 | 5mil minimum traces & 5mil minimum spacing
6/5 | 6mil minimum traces & 5mil minimum spacing
AMC | aluminum metal core
ACY
additive
Adhesive
Altium
Annular Ring
Annulus
AOI automatic optical inspection
Aperture
Arc
Array
assembly
AutoCAD
autorouter
Autotrax
Autotrax
AXI automated x-ray inspection
Axial
Bakelite
BGA
Blind Via
bloat
board house
Board Thickness
Breadboard
buffer
Buried Via
bus
C4 Controlled collapse chip connection
CAD
CAM files
CAM
Capture
Card Edge connector
Castellations
CEM-1
CEM-3
Centroid
centroid
Chip Scale Package
clad
Clearance
Coating (Spin, Roll, Film)
COB
Component Side
Component
Computer Aided Design
Computer Aided Machining
Conformal Coating
Conformal coating
connect
Copper Foil
Copper weight
Copper
copper
courtyard
cte coefficient of thermal expansion (see tce)
Curve, open
delamination
DFSM Dry film soldermask
Dialectric
Diameter
Dielectric
differential pair
DIP
Discrete Component
double-sided
DRC design rule check
Drill file
Eagle
EDF
EDI Electronic Data Interchange
Endpoint
ENIG Electroless Nickel Immersion Gold
epoxy resin
ESD Electrostatic Discharge
Etching
Excellon
explicit layer
fabrication fab
Feedthrough Via
fidocad
Fiducial
Finger
Finite Element Filter
Fixture
flags
Flex
Flip chip
flood fill
Flux
Flying probe
Foil
font
Footprint
FR-1
FR-2
FR-3
FR-4
Gcode
gEDA
Gerber
grid snap
grid-pitch
grid
Hard Gold pcb surface finish (slip rings, fingers, etc)
HASL Hot Air surface levelling
High Density Interconnect(HDI)
Hole
Immersion Silver
Immersion Tin
implicit layer
Integrated Circuit
IPC (circa 1957)
JIT
Kapton
KiCAD
Knife
Laminate
Land
Laser
Layer Group
Layer Sequence
Layers (Physical)
Layers (Virtual)
Library
Lihata
mask
Masonite
Mentor
Mil
Milling
milling
Mirroring
Mouse bites
Multilayer
neckdown
negative process
Negative transfer
NEMA
Net
Netlist
ODB++
OrCAD
OSP Organic Solderability preservative
outline
Package
Pad
padstack
Panel Service
panel
Panelization
paste stencil
paste
Path
pcb-rnd
PCB
PDIP
phenolic resin
Photoengraving
Photoresist
pick and place pnp
Pin
pinout
pitch
PLCC plastic lead chip carrier
plotter
Polygon hole
Polygon, complex
Polygon, concave
Polygon, convex
Polygon, irregular
Polygon, regular
Polygon, simple
Polygon
polygon
positive process
Positive transfer
Protel
PTH
Pyralux AP
Pyralux FR
Pyralux LF
QFP
Radial Lead
Raster
rat
Ratsnest
refdes Reference Designator, https://en.wikipedia.org/wiki/Reference_designator
reflow
Registration
resin
resist
RF
Rigid-Flex
Route and Retain
routing style
Routing
routing
RS-274D
RS-274X
Rubylithe
Scoring
Short
Silk Screen
Silk
silk
single-sided
SIP
slot
SMD
SMOBC soldermask over bare copper prevent unintended flow of tin/lead during reflow
SMT
Snap
SOIC
Solder Side
Solder
STEP
Subcircuit
Substrate
Subtractive
Symbol
Tape out
TCE thermal coefficient of expansion
tEDAx
Tented(Via)
terminal
TG Glass transition temp
Thermal Via Thermal relief
Thou
Tin Whisker
Tin
TinyCAD
Tolerance
tombstone
tooling
toolpath generator
toolpath
toporouter
Trace
TT toner transfer
V-Cut aka v-scoring
V-score
Vcc
Vdd
Vector
Via stitching
Via
Wave Solder
Wire bonding
XY